EZ Glue
Semi conductor wafers fab
EZ Glue
Assistance device for semi conductor ingot gluing.
- User friendly design
- Robust construction
- Suitable for HCT, Toyo, PSS/Meyer Burger ingot holder
- Other type of ingot holder on demand
Specifications
EZ Glue
Assistance device for semi conductor ingot gluing with orientation.
- Ingot size: ø 6''-8'' / ø 12'' on demand
- Ingot length: up to 500 mm
- Gluing tilt & accuracy: 10° max & less than ± 2 min
- Top beam: with passive clamping brakes & weight compensation
- Measuring: ingot axis, vertical position & table rotation
So What’s Next?
WE'RE READY! Question us.
CONTACT
Easy Engineering SA
Route du Stand 11
1880 Bex
Switzerland
+41 21 946 48 55
info@easy-engineering.ch