Easy Engineering is your trusted expert

partner in wire sawing technology,

providing advanced wire sawing machine

for slicing hard and brittle materials

into high-precision wafers.

Our wire sawing machines can be fully customised to meet each customer's specific needs and production requirements.

With over 30 years of experience in the wire slicing industry, we deliver solutions that maximise cutting efficiency while minimising material loss.

Our technology is ideal for cutting blocks of a wide range of hard and brittle materials, including but not limited to:

  • Gemstones
  • Ruby & Sapphire
  • Ceramics
  • Optic materials
  • Semi conductor materials
  • Advanced materials
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Easy Engineering is also a manufacturer of custom-built

machines, designed and developped to meet each

customer's specific requirements.

With our highly skilled team of mechanical, electrical and software engineers,

we develop innovative and efficient solutions tailored to your projects.

Serving a wide range of industries, we design and manufacture

specialized equipment for applications including

milling, packaging, pharmaceuticals, and

many other industrial sector.

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Wafers sliced with our EZ 160-6
Wafer thickness can be tailored to meet the specific requirements of each application.
For certain materials, particulary gemstones, reducing the thickness gradually reveals their natural transparency, showcasing unique patterns and characteristics.
Nature's beauty is truly one of kind and cannot be replicated.

Contact
Easy Engineering SA
Route des Courtraits 21
1880 Bex
Switzerland
: + 41 21 946 48 55
: info@easy-engineering.ch
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